Thin Film MEMS

Thin Film MEMS

Features

Features
  • High frequency, high performance, low temperature drift
  • Ceramic substrate with coplanar waveguide 50Ω output
  • Surface-mount design, suitable for multi-chip integrated modules
  • Precision Conductors:
    Conductor width/thickness ratio ≥ 3; minimum line width/spacing: 5μm; tolerance: ±1μm
  • Via Metallization:
    Hole diameter: D ≥ 0.1mm; aspect ratio D/H ≥ 0.3
    Edge width: C ≥ 0.05mm
    Via resistance: R ≤ 10mΩ
  • Precision Resistors:
    Precise control of line geometry and film thickness
    Sheet resistance range: 5Ω/□ ~ 200Ω/□
    Temperature coefficient: 20 ± 60 ppm (-50°C ~ 150°C)
    Resistance tolerance: ±2%; laser trimming accuracy: ±0.1%
    Resistor line width/spacing: ≥ 5μm

Typical Characteristics

12-1Typical Characteristics
12-2Typical Characteristics

Parameters

Product Specification Sheet - Data is for reference only. Actual parameters may vary. Customization available according to customer requirements.

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