CQFP Packages

CQFP Packages

Features & Applications
HTCC Materials
HTCC Board Rules
Parameters

Features & Applications

Features
  • Typically features metal leads extending from the bottom surface, suitable for surface-mount technology (SMT) assembly processes.
  • Common lead pitches include 0.4mm, 0.5mm, 0.65mm, 0.8mm, 1.0mm, and 1.27mm.
  • Compact size, lightweight, high packaging density, and convenient installation.
Applications
  • Widely used in large-scale integrated circuits, microprocessors, signal processors, and other semiconductor devices.
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Ceramic Packing Ceramic Substrate Dielectric Waveguide Filter Dielectric Filter Thin Film MEMS LC Filter Dielectric Resonator Cavity Filter Low PIM Passive Device Dielectric Antenna & Module IDAS Antenna Metal Matrix Composite(MMCS) High Gain Antenna High Speed Test Instrument