CQFN Packages

CQFN Packages

Features & Applications
HTCC Materials
HTCC Board Rules
Parameters

Features & Applications

Features
  • Features symmetric leadless pads on all four sides, capable of transmitting control signals or RF signals from DC to 40GHz.
  • Die attach grounding methods include metallized grounding or metal heat sink grounding to meet diverse thermal management requirements of different chips.
  • Package sealing options encompass parallel seam welding, alloy soldering, adhesive bonding, and various other lid attachment methods.
  • Compact size, lightweight, excellent high-frequency performance, ideal for packaging low-power chips.
Applications
  • Applications include SIP (System-in-Package), optical communication modules, MEMS chips, FPGA packaging, CMOS image sensor packaging, automotive electronics, aerospace and other high-reliability chip packaging solutions, as well as millimeter-wave HTCC (High-Temperature Co-fired Ceramic) substrates.
☰ Categories
Ceramic Packing Ceramic Substrate Dielectric Waveguide Filter Dielectric Filter Thin Film MEMS LC Filter Dielectric Resonator Cavity Filter Low PIM Passive Device Dielectric Antenna & Module IDAS Antenna Metal Matrix Composite(MMCS) High Gain Antenna High Speed Test Instrument