Image Sensor Packages

• The ceramic package for image sensors is fabricated using Al₂O₃ (aluminum oxide) and AlN (aluminum nitride), offering structural characteristics of high strength and rigidity. Combined with a dual-layer cavity design, it better meets product requirements for miniaturization, thin profile, and high reliability. Meanwhile, Al₂O₃ and AlN exhibit high thermal conductivity, effectively satisfying the stringent thermal management demands of various image sensors.

High Packaging Density, High Precision:

• Min. Pitch: 160 μm; Min. Line Width: 100 μm;
• Min. Line Spacing: 60 μm; Min. Layer Thickness: 100 μm;