CBGA Packages

CBGA Packages

Features & Applications
HTCC Materials
HTCC Board Rules
Parameters

Features & Applications

Features
  • Spherical solder bumps are fabricated in an array pattern on the package backside to replace traditional leads/pins.
  • Terminal pitch is adjustable based on die area, typically 1.27mm, 1mm, or 0.8mm; customizable per customer requirements. A heat sink can be optionally integrated depending on the chip's power dissipation needs.
  • Compact size, excellent thermal dissipation, superior moisture resistance, and high reliability.
Array Configurations
  • 7×7, 8×8, 10×10……20×20, or customized according to customer specifications.
Applications
  • Applications include SIP (System-in-Package), optical communication modules, MEMS chips, FPGA packaging, CMOS image sensor packaging, automotive electronics, aerospace and other high-reliability chip packaging solutions, as well as millimeter-wave HTCC (High-Temperature Co-fired Ceramic) substrates.
☰ Categories
Ceramic Packing Ceramic Substrate Dielectric Waveguide Filter Dielectric Filter Thin Film MEMS LC Filter Dielectric Resonator Cavity Filter Low PIM Passive Device Dielectric Antenna & Module IDAS Antenna Metal Matrix Composite(MMCS) High Gain Antenna High Speed Test Instrument