Metal Matrix Composite(MMCS)_Jiangsu Caiqin Technology Co., Ltd.

Metal Matrix Composite Ceramic

Copper-Diamond Composite

Porous Ceramic Material (Porous Silicon Carbide)

Resin-Based Ceramic Material (Alumina Ceramic Composite)

Silicon Carbide Ceramic Composite

Materials:

Various ceramic matrices available: SiC, Al₂O₃, B₄C (Boron Carbide), etc.
Various metal materials available: Al, Cu, Au, etc.

Types: Al/SiC, Al/Al₂O₃, Cu/Diamond, Al/Diamond, Cu/SiC, Cu/B₄C, Au/B₄C, etc.

Material Properties:

Thermal Conductivity: 180-800 W/(m·K)
Coefficient of Thermal Expansion (CTE): 4-11 ppm/°C
Density: 2.9-5.8 g/cm³

(Note: The properties of the final material can be flexibly adjusted by modifying the volume fraction of the ceramic reinforcement/diamond.)

Features & Advantages:

High stiffness (shatter-resistant), low density (lightweight), high wear resistance (scratch-resistant), high thermal conductivity, high dimensional stability, low coefficient of thermal expansion, and low deformation.

Composite Ceramic Material Products

Product Name: IGBT Heat Sink Fins

Material: Metal Matrix Composite Ceramic — Aluminum-Silicon Carbide (AlSiC)
This refers to the composite of aluminum with a high volume fraction of silicon carbide, resulting in an electronic packaging material with low density, high thermal conductivity, and low coefficient of thermal expansion (CTE), designed to solve thermal failure issues in electronic circuits.
Replaces: Encapsulation housings and heat sinks for power modules (such as IGBTs and SiC modules) traditionally made from high-density materials like Copper-Tungsten (CuW) and Molybdenum-Copper (MoCu).
Core Advantages: Achieves significant lightweighting while maintaining high thermal conductivity and low thermal expansion, with the potential for integrating complex cooling channels.
Performance Features:
- 1. Efficient Heat Dissipation & Lower Junction Temperature: Thermal conductivity reaches 170-240 W/m·K, far exceeding traditional alumina ceramic substrates (20-30 W/m·K). It rapidly dissipates concentrated heat from IGBT chips during operation, reducing chip junction temperature by 15-30°C, directly enhancing IGBT power density and overload capacity.
- 2. Precise CTE Matching & Risk Mitigation: The Coefficient of Thermal Expansion (CTE) can be tuned to 6.5-9.5×10⁻⁶/K, minimizing the difference with silicon chips (2.6×10⁻⁶/K) and Aluminum Nitride ceramics (4.5×10⁻⁶/K). This significantly reduces thermal stress during temperature cycling, preventing failures such as solder layer fatigue cracking and substrate warping, thereby increasing the cyclic life of IGBT modules by 3-5 times.
- 3. Lightweight & High Strength for Harsh Conditions: With a density of approximately 2.95 g/cm³, it is only 1/5th that of Copper-Tungsten (Cu/W) substrates, significantly reducing the weight of IGBT components in automotive and aerospace applications. Its specific stiffness is 3 times that of pure aluminum, offering excellent vibration and shock resistance, suitable for harsh environments like new energy vehicles experiencing bumps and extreme temperature variations.
- 4. Process Compatibility & Integrated Packaging: Supports EDM (Electrical Discharge Machining) and precision grinding. Surfaces can be plated with Nickel, Gold, Tin, etc., ensuring full compatibility with IGBT packaging processes like soldering and wire bonding. It also provides good electromagnetic shielding, meeting the integrated and miniaturized design requirements of high-power IGBT modules.
Applications: Heat sink fins are widely used in rail transportation, such as high-speed railway projects.

Product Name: AlSiC Copper-Plated Sheet

Alternative Materials: Aluminum alloys, Titanium alloys, Steel, Copper, Tungsten-Copper, Molybdenum-Copper, etc.
Performance:

Material Name	Density (Kg/m³)	CTE @ RT-125°C (ppm/°C)	Thermal Conductivity (W/m·K)	Electrical Conductivity (MS/m)
AlSiC	2.93±0.04	9~11	> 160	≥3.5

Core Advantages: Lightweight, improved durability, superior heat dissipation, and low thermal expansion.
Applications: Due to its low density, excellent impact resistance, high thermal conductivity, and low expansion, AlSiC solves thermal failure issues in electronic circuits. It is suitable for high-power electronics, new energy vehicles, semiconductor packaging, and other scenarios.

Product Name: Porous Medical Liquid Ceramic Flow Meter

Material: Made from high-purity Alumina (Al₂O₃) or Zirconia (ZrO₂) ceramics.
Advantages:
- 1. Ultimate Biocompatibility & High Cleanliness: The surface is smooth and dense, preventing the adhesion of drug residues, blood components, or bacteria, complying with GMP cleanliness standards in the medical field. The ceramic material poses no risk of metal ion leaching, avoiding contamination of drug solutions and irritation to human tissues, making it especially suitable for sensitive scenarios involving blood contact or long-term infusion. Additionally, the smooth surface facilitates high-temperature steam sterilization or chemical disinfection, allowing for repeated use without microbial growth, ensuring hygiene safety in medical processes.
- 2. High Precision & Wide Range Adaptability: The flow field rectification effect of the porous symmetric structure achieves a measurement accuracy of ±0.5% and a repeatability error of ≤±0.2%, capable of precisely capturing minute flow changes in medical liquids (such as micro-infusion scenarios of 70~4000 nl/min). The rangeability can reach 10:1, expandable to 30:1 through segmented compensation technology. This meets both routine drug infusion monitoring and high-precision micro-dosing requirements in intensive care, enabling multi-scenario reuse of a single device.
- 3. Strong Corrosion Resistance & High Structural Stability: Ceramic materials possess excellent chemical corrosion resistance. Except for hydrofluoric acid, they can withstand erosion from various medical drugs (such as acidic/alkaline drugs, chemotherapy agents) and disinfectants, without material aging or corrosion damage over long-term use. With a hardness exceeding HRA85 (second only to diamond), they resist abrasion from fluids containing微小 particles (such as blood products and suspension drugs), offering a service life far superior to traditional metal or rubber flow meters, thereby reducing maintenance and replacement costs for medical equipment.
- 4. Low Damage & Low Energy Consumption, Suitable for Sensitive Medical Fluids: The through-hole array design of the porous ceramic throttle component results in low pressure loss (pressure drop ≤0.05 MPa) as fluid passes through. This prevents shear damage to sensitive medical fluids (such as blood and biological preparations), avoiding the destruction of cell activity or active drug ingredients. Meanwhile, the low-energy design accommodates the low-power supply requirements of medical devices, making it particularly suitable for portable medical infusion equipment.
- 5. Easy Installation, Adaptable to Compact Medical Equipment: The porous structure optimizes flow field characteristics, significantly shortening the straight pipe section requirements before and after the flow meter (upstream ≥5D, downstream ≥3D, where D is the pipe inner diameter). Compared to traditional flow meters (upstream ≥10D, downstream ≥5D), this saves installation space and allows for flexible integration into compact medical devices (such as hemodialysis machines and micro-infusion pumps), reducing the overall design complexity of the equipment.
- 6. Stable Signal & Strong Anti-Interference Capability: The porous structure effectively suppresses vortices and flow field disturbances, resulting in more stable differential pressure signals and a significantly improved signal-to-noise ratio. It can resist high-frequency electromagnetic interference in medical environments (such as interference from high-frequency electrosurgical units and monitors in operating rooms), ensuring the accuracy and continuity of flow measurement data, providing a reliable basis for precise control in medical operations.

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