Ceramic Packing
Ceramic Substrate
Dielectric Waveguide Filter
Dielectric Filter
Thin Film MEMS
LC Filter
Dielectric Resonator
Cavity Filter
Low PIM Passive Device
Dielectric Antenna & Module
IDAS Antenna
Metal Matrix Composite(MMCs)
High Gain Antenna
High Speed Test Instrument

CAIQIN

Ceramic Substrate

DPC & AMB

DPC Ceramic Substrate
DPC Ceramic Substrate

Features
  • Based on high-performance ceramic materials: Al2O3, AlN, Si3N4, ZTA, high-Q dielectric ceramics, etc.
  • High-reliability magnetron sputtering and electroplating processes
  • Optional fired ceramic laser shaping process: high efficiency and low cost
  • Optional green tape forming process: high-quality via holes and edge quality
  • Substrate thickness range: 0.3-3mm
  • Plating layers: Cu, Ag, Sn, Ni, Au; maximum plating thickness: 100um
Applications
  • Heat sinks for high-power lasers, LED submounts, high thermal conductivity heat sink substrates
  • Wireless communications, RF microstrip circuits
AMB Ceramic Substrate
AMB Ceramic Substrate

Features
  • Based on high thermal conductivity ceramic materials: Si3N4, AlN, Al2O3, etc.
  • High-reliability AMB (Active Metal Brazing) brazing paste system
  • Substrate thickness range: 0.3-3mm
  • Copper foil thickness: 100-800um
  • Supports surface finishes: Cu, Ag, Sn, Ni, Au
Applications
  • Heat sink substrates for high-power IGBTs
☰ PRODUCTS
Ceramic Packing Ceramic Substrate Dielectric Waveguide Filter Dielectric Filter Thin Film MEMS LC Filter Dielectric Resonator Cavity Filter Low PIM Passive Device Dielectric Antenna & Module IDAS Antenna Metal Matrix Composite(MMCs) High Gain Antenna High Speed Test Instrument